Services

Component modification, end to end.

A precision service catalog engineered for Military, Aerospace, and other High-Reliability electronic assemblies.

Six-axis robotic hot solder dip per GEIA-STD-0006, with precise control of bath, dwell, immersion, and extraction.

Reliable, repeatable reballing in compliance with IEC/TS62647 — Pb-free, Eutectic (Sn63Pb37), or High Lead (Sn10Pb90).

Lead-free to leaded conversion programs and managed inventory for military and aerospace supply chains.

Robotic SnPb dynamic solder wave process for gold removal per IPC-J-STD-001 criterion 4.5.1.

XRF, X-Ray inspection, and temperature up-screening from commercial to industrial / military grade.

CGA column attachment in partnership with TopLine — Pb80/Sn20 copper-wrapped and Pb90/Sn10 plain columns.

Custom lead forming for flat-pack and surface-mount components, engineered to specification.

High-yield component recovery from populated assemblies for obsolescence and supply-chain continuity.

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