Testing, Temperature Up-Screening & Programming

XRF Analysis

ROHS COMPLIANCE SCREENING USING MOBILE XRF (X-RAY FLUORESCENCE)

Worldwide Restriction of Hazardous Substances (RoHS) regulations continue to impact the manufacturers of electrical and electronic goods and their supply chains. BGA TEST & TECHNOLOGY is capable of identifying five commonly found substances.

• ▸Quantify total lead (Pb), cadmium (Cd), mercury (Hg), chromium (Cr) and bromine (Br)
• ▸Provide pass/fail designations for each sample, with visual identification of the out of spec elements; use default thresholds or easily customize each element
• ▸Ability to customize the display, include the RoHS elements, all measured elements, or only those selected
• ▸50 KV miniaturized x-ray tube for superior detection limits.
• ▸Ability to measure alloys, to plastics and polymers, to mixed materials
• ▸Electrical Testing (Pre & Post Re-balling)

Elemental Analysis using XRF — A Unique Set of Fingerprints

Each of the elements present in a sample produces a unique set of characteristic x-rays that is a "fingerprint" for that specific element. XRF analyzers determine the chemistry of a sample by measuring the spectrum of the characteristic x-ray emitted by the different elements in the sample when it is illuminated by x-rays. These x-rays are emitted either from a miniaturized x-ray tube, or from a small, sealed capsule of radioactive material.

X-Ray Inspection

Radiography (or X-Ray) inspection is a universal technique used to inspect for damaged, defective or counterfeit components and is an integral element of the inspection processes incorporated within IDEA 1010B, CCAP 101, AS5553 and AS6081 standards. These standards and processes were created in response to a significant and increasing volume of fraudulent/counterfeit electronic parts entering the aerospace supply chain, posing significant performance, reliability, and safety risks.

X-ray inspection gives you the unique ability to "see" what is inside an electronic component without damaging it. Visual comparison of internal construction, uniform construction, presence or absence of a die, die paddle shape and size, lead frame size, shape, wire bond pin out and die bonding voids are some of the aspects that can be examined using our state of the art X-RAY equipment.

BGA Test & Technology has a state of the art X-Ray system used to micro focus real-time inspection of electronic components, multi-Layer circuit boards, sealed components and SMT assemblies. It is equipped with a 90kv, 5micron X-ray tube, detector and positioner with image intensifier with zoom lens and CCD camera. The X-ray equipment runs on verifier software which provides up to 64 frames of integration. Software also allows for live averaging thus providing the best image possible during real-time motion.

Temperature Up-Screening to Industrial / Mil Aerospace Grade

Capable of Up-Screening all Components from Commercial Temp to Industrial / Military Temp, including Diodes, Transistors, EEPROM's, OTP's, FPGA's, Thyristors, SCR's, MCU's, SRAM's, NVRAM's, DRAM's, Resistors, Capacitors, Inductors, Voltage regulators, Flash memories, Analog and Digital Integrated circuits.

Utilizing ATV Digital Tester & PWS Analog Tester we are capable of testing in the range of −75°C to +200°C with multiple temperature chambers using the ATV / PWS digital & analog tester. All processes are MIL STD compliant. All tests include a comprehensive engineering report.