Reballing

BGA TEST & TECHNOLOGY has developed a reliable and repeatable process, in compliance with the objectives and requirements of IEC/TS62647, for re-balling and ball attach with the capability to convert Pb-free spheres to Eutectic Solder (Sn63Pb37) or High Lead solder (Sn10Pb90) spheres for Military, Aerospace, and other High-Reliability Electronic Assemblies.

This process will also work in reverse to convert tin-lead spheres to Pb-free (SAC305) spheres for many commercial applications with RoHS restrictions.

Brief Description of Process

After going through a QA gate upon arrival, incoming lots undergo the following steps:

• ▸Incoming Inspection Process
• ▸Moisture Removal — Pre-Bake
• ▸De-balling: Automatic Using Six Axis ROBOT — Solder Sphere removal process
• ▸Automated Cleaning: Trident LD system
• ▸Inspection Post Deballing
• ▸Moisture Removal — Post Deball
• ▸Re-balling: Proprietary Solder Sphere attachment process
• ▸Automated Cleaning: Trident LD DE fluxer system
• ▸Drying Post Re-ball
• ▸Baking to remove Moisture post Re-ball
• ▸Final Inspection Process
• ▸Marking If Required
• ▸Marking Inspection
• ▸Final Baking Per MSL of the Component
• ▸Packaging and Shipping

Devices pass through the process cycle with strict quality and process control for repeatable and reliable results. Our Re-balling process has been proven to meet the requirements of ADHP (Aerospace, Defense, and High Performance) industries using the following qualification criteria:

• ▸CSAM (Pre & Post Re-balling) — Analysis for De-lamination
• ▸Ball Shear — Strength of ball adhesion
• ▸Coplanarity Test
• ▸Scanning Electron Microscope (SEM) — Post-Ball Shear Analysis
• ▸Cleanliness — Ionic Contamination Analysis
• ▸Electrical Testing (Pre & Post Re-balling)