BGA Test & Technology utilizes state of the art, 6-axis Robotic Hot Solder Dip (RHSD) machines for processing components. Operators can control all process parameters including:
- ▸Bath and Pre-heat Temperatures
- ▸Immersion depth
- ▸Dwell time
- ▸Insertion speed and acceleration
- ▸Extraction speed and acceleration
Our high volume, high mix Robotic system is designed to flux, Pre-heat, Solder Dip, and clean virtually any style package of electronic component with a Precise Repeatable Process.
Our RHSD system allows us to comply with (meet any of) the following industry standards for solder dipping/solderability.
- ▸GEIA-STD-0006 For Solder Dip to Replace Finish
- ▸ANSI-J-STD-002 Method A, B, C & D (w/wave)
- ▸IEC-68-2-20 Test TA, Para 4.9, & Test TB
- ▸IEC-68-2-58 Test TD
- ▸JESD22-B102D Method 1
- ▸JESD22A111 Method 5.6.2
- ▸JISZ-3198-4 Method B
- ▸Mil-STD-202 Method 208
- ▸Mil-STD-883
Please contact us for more information or quote.
sales@bgatechnology.com — RHSD Robotic Hot Solder Dip