BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the BGA reballing standards of IEC/TS62647 required by both Military & Aerospace customers. Our innovative systems allow us to provide a cost effective, high quality, quick turn solution. We have invested in the very latest technology, equipment, and facility to meet all of our customers current and future needs.

BGA Test & Technology can also provide custom solder dipping solutions based on customer tailored requirements.